| abstract |
A light reflection layer that causes an increase in manufacturing cost when a light emitting device such as a light emitting diode (LED) device is flip-chip mounted on a wiring board using an anisotropic conductive adhesive. An anisotropic conductive adhesive that can improve the light emission efficiency without providing an LED element on the LED element is provided. A light-reflective anisotropic conductive adhesive used for anisotropically conductively connecting a light-emitting element to a wiring board contains a thermosetting resin composition, conductive particles, and light-reflective insulating particles. Such light-reflective insulating particles are obtained by surface-treating titanium oxide particles with a kind selected from the group consisting of Al 2 O 3 , SiO, SiO 2 , ZnO, ZnO 2 and ZrO 2 . The titanium oxide content of the light reflective insulating particles is 85 to 93%. [Selection] Figure 2 |