http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012212827-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3425ad8819df0d2dfcfb8a51f50269b7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5b1af7cd3b41b4fc93829fb9922968a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58d38ca9b4bad675c913595f36d5b181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b9efa975936d1f2b2d51cba776f2606 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9f6ff7a11f7cedfeca22ba78597d23b |
| publicationDate | 2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012212827-A |
| titleOfInvention | Manufacturing method of package substrate for mounting semiconductor device |
| abstract | It is possible to form a flip-chip connection terminal that secures an adhesive force even if it is fine, and to supply a solder amount necessary for flip-chip connection with a bump of a semiconductor element with high accuracy. Provided is a method for manufacturing a package substrate for mounting a semiconductor element, which can cope with the increase in density and has excellent reliability. A step (A) of forming a flip chip connection terminal with an embedded circuit 2 having an upper surface exposed on an insulating layer 3 and pressing a solder particle 7 held on sheets 5 and 6 on the flip chip connection terminal Heating and pressurizing step (B), transferring the solder particles onto the flip chip connection terminal (C), removing the sheet, and reflowing the solder particles transferred onto the flip chip connection terminal (D) and a manufacturing method of a package substrate. [Selection] Figure 1 |
| priorityDate | 2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.