http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012209460-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1173 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2011-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f2c592f059b334dd002b4b5283c6cad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff2d03172769bd7bc81d5732425af99d |
| publicationDate | 2012-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012209460-A |
| titleOfInvention | Pattern forming method and pattern forming apparatus |
| abstract | A pattern forming method and a pattern forming apparatus capable of forming a conductor in a hole by modifying only the inner surface of the hole, such as a via hole, a contact hole, or a through hole. A pattern forming method according to the present invention includes a step of detecting a strain on a substrate in which a hole is formed, and, when the substrate is strained, for irradiating the hole with a laser beam based on the strain of the substrate. Creating first correction data for correcting irradiation data, generating second correction data for correcting droplet ejection data for depositing conductive ink in the hole, and reactive gas in the hole of the substrate The laser beam is irradiated only on the inner surface of the hole portion based on the irradiation data when there is no distortion of the substrate, and based on the first correction data when there is distortion of the substrate. The step of modifying the inner surface of the substrate, the conductive ink in the hole, the droplet ejection based on the droplet ejection data when the substrate is not distorted, and the second correction data when the substrate is distorted The process of carrying out. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7230276-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016065979-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107231757-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2021199421-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021199421-A1 |
| priorityDate | 2011-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.