| abstract |
Disclosed is an insulating layer-forming composition having both curability, developability and metal adhesion. A composition for forming an insulating layer comprising a polymer, a polyfunctional monomer, a photopolymerization initiator, an epoxy resin and a solvent, wherein the polymer has a structure derived from a (meth) acryl monomer. A structural unit derived from a carboxyl group-containing monomer having a carboxyl group and an unsaturated double bond, and an epoxy having an epoxy group and an unsaturated double bond in the carboxyl group of the structural unit (2) The polybasic acid anhydride is reacted with the hydroxyl group generated by the reaction of the epoxy group with the structural unit (3), which is a structure obtained by reacting the group-containing compound, and the carboxyl group contained in the structural unit (3). And the polymer has a weight average molecular weight in the range of 5,000 to 100,000, for forming the insulating layer. The acid value of the Narubutsu is less than or equal to 150mgKOH / g. [Selection figure] None |