| abstract |
A high-performance cured film excellent in embedding property, thermal shock resistance, developability, insulation, and resolution of an exposed portion can be obtained, and a semiconductor package substrate having a small L / S (line space). Providing a silica dispersion composition suitable for solder resists that can be used. A silica dispersant comprising a polyurethane resin having at least an acidic group and a basic group, silica fine particles, and a thermal crosslinking agent are contained, and the amine value of the silica dispersant is 0.65 mmol / g or more. This is a silica dispersion composition. [Selection figure] None |