Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
filingDate |
2012-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_261cb31eab2c64ea5303853156232037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fdbf5ac7a41ddd68cf3236a40c6fc9ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51bfc895b57e9130c86a7635f7e40537 |
publicationDate |
2012-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2012190804-A |
titleOfInvention |
Anisotropic conductive material and connection structure |
abstract |
An anisotropic conductive material that can be easily connected between electrodes and can improve conduction reliability when used for connection between electrodes, and a connection structure using the anisotropic conductive material provide. An anisotropic conductive material according to the present invention includes conductive particles 1 and a binder resin. The conductive particles 1 include resin particles 2 and a conductive layer 3 that covers the surface 2 a of the resin particles 2. At least the outer surface layer of the conductive layer 3 is a solder layer 5. The connection structure according to the present invention includes a first connection target member, a second connection target member, and a connection portion that connects the first and second connection target members. The connection portion is formed of the anisotropic conductive material. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160077013-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9999123-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102228473-B1 |
priorityDate |
2010-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |