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filingDate 2011-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97cf5f5b970495ec2740b4829eefdff3
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publicationDate 2012-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012186267-A
titleOfInvention Epitaxial substrate
abstract Provided is an epitaxial substrate that uses a silicon substrate as a base substrate and is suppressed in warpage to an extent that there is no problem as compared with the substrate size, and is suitable for manufacturing a semiconductor element. An epitaxial substrate includes a base substrate made of a silicon single crystal, and a group III nitride layer group made of a plurality of group III nitride layers formed on the base substrate. The base substrate 1 has p-type conductivity by adding boron, has a specific resistance of 0.01 Ω · cm to 0.1 Ω · cm, and includes a plurality of III Group nitride layers 2, 3 and 4 each contain at least Al or Ga, the amount of warpage of the epitaxial substrate is SR (unit: μm), the total film thickness of the nitride layer group is te (unit: μm), the base substrate When the film thickness of 1 is ts (unit: mm) and the diameter of the base substrate 1 is ds (unit: mm), the normalized warpage index K is K = {(SR / te) × (ts / ds) 2 } The relational expression of ≦ 1 × 10 −3 is satisfied. [Selection] Figure 1
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