| abstract |
Even when a semiconductor element is flip-chip mounted on a printed circuit board, the thickness of the semiconductor element can be reduced, and a space between the printed circuit board and the semiconductor element can be satisfactorily embedded, and the HAST resistance is improved. An adhesive for circuit connection, an adhesive sheet for circuit connection, and a method for manufacturing a semiconductor device capable of producing an excellent semiconductor device are provided. An adhesive for circuit connection according to the present invention is an adhesive for circuit connection for connecting opposite circuit boards, and contains an acrylic rubber, a thermosetting component and a curing accelerator, and the acrylic rubber The copolymerization ratio of acrylonitrile is 15% by mass or less. [Selection figure] None |