http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012182293-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2011-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e794051f1ecd9a1ed8a4d4cd5e48e25b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e886210741a28c1ce37e1783dfe6ee5 |
| publicationDate | 2012-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012182293-A |
| titleOfInvention | Electronic component mounting substrate and manufacturing method thereof |
| abstract | The present invention provides an electronic component mounting board that does not require a special member such as an underfill material and suppresses the occurrence of cracks due to external impact or thermal stress at the joint between an electronic component and a wiring board. A wiring board having at least one printed circuit board having a conductive wiring layer formed on at least one surface of an insulating board including a resin and at least one surface of the insulating board, and having a plurality of land electrodes on the surface. An electronic component mounting substrate including an electronic component having a plurality of terminal electrodes on the surface, wherein the land electrode and the terminal electrode are electrically connected via a bonding member, and the bonding member is An intermetallic compound having a melting point of 300 ° C. or higher, which is generated by a reaction between a first metal containing Sn and a second metal having a higher melting point than the first metal, and is formed on the surface of the second metal. The difference between the lattice constant of the intermetallic compound to be generated and the lattice constant of the second metal is 50% or more with respect to the lattice constant of the second metal, and has a plurality of pores. Electronic parts Board. [Selection] Figure 4 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10098229-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016076094-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016076094-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014129008-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016115825-A |
| priorityDate | 2011-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 90.