| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2012-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7f25ae21d3282ee91ab3893ffa14ee7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6413736be9c034f094e97e98af16f8ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95caed111b771440f8f713a2b7ee7d25 |
| publicationDate |
2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012178586-A |
| titleOfInvention |
Semiconductor device |
| abstract |
A semiconductor device having excellent processability and reliability is provided. One or more insulating layers made of a resin composition containing a component of an organic resin having an epoxy resin, an epoxy resin curing agent and an average primary particle diameter of 1 μm or less are provided on a semiconductor surface on which a necessary circuit is formed, A semiconductor device in which a circuit 3 using copper as a wiring conductor in the same layer and between layers is formed at an arbitrary location. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015189120-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017212400-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7058467-B2 |
| priorityDate |
2006-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |