http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012178427-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
filingDate 2011-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fecc7b0cc800942959d929c3bebc729b
publicationDate 2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012178427-A
titleOfInvention Electronic component storage package and electronic device
abstract PROBLEM TO BE SOLVED: To improve the operability of an electronic component at a high frequency by reducing a reflection loss at the time of inputting / outputting a high frequency signal even if an electric signal is increased in frequency. SOLUTION: A substrate 1, a mounting base 5, a circuit board 4, a frame body 2 in which a through hole 2a is formed in a side portion, and a circuit board 4 are electrically connected to the through hole 2a. In the electronic component storage package including the coaxial connector 3 connected to the frame 2, the frame 2 has a step 2 b protruding from the inner surface below the through hole 2 a of the frame 2 toward the mounting base 5. The mounting base 5 is formed with a protruding portion 5a protruding from the upper surface of the mounting base 5 to the coaxial connector 3 side, and the upper surface of the stepped portion 2b and the protruding portion 5a The lower surface is joined. Impedance mismatch is reduced, high-frequency signal reflection loss is reduced, and transmission efficiency is improved. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012227219-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012244002-A
priorityDate 2011-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 18.