| abstract |
An adhesive tape used for temporarily fixing or protecting an electronic component, having high initial adhesive strength to the electronic component and lowering the adhesive strength even when exposed to high temperatures. It is difficult to provide a pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape for heat-resistant temporary wear that have adhesive force necessary for fixation and protection, and can be easily peeled off without leaving any adhesive when peeled and removed. A pressure-sensitive adhesive composition for heat-resistant temporary wear used for temporarily fixing or protecting an electronic component in a manufacturing process of the electronic component, and forming the pressure-sensitive adhesive layer 2 made of the pressure-sensitive adhesive composition A pressure-sensitive adhesive composition comprising an acrylic polymer, an energy ray polymerizable oligomer, a polymerization initiator, and a crosslinking agent as a material for use, wherein the acrylic polymer is a copolymer having a repeating unit derived from acrylonitrile. object. [Selection] Figure 1 |