http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012169373-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
filingDate 2011-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e98290740827f94acacee95951765ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38018b1182a2f709c1db7bab08619a6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed356cbd06c8cafe0465f9d79e5568da
publicationDate 2012-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012169373-A
titleOfInvention Wiring board manufacturing method and wiring board
abstract To provide a manufacturing method capable of efficiently manufacturing a highly reliable wiring board having a highly reliable conductor pattern in which occurrence of cracks, disconnection, short circuit and the like is prevented. A ceramic molded body preparing step for preparing a sheet-shaped ceramic molded body 15 made of a material containing a ceramic material and a binder, and forming a conductor pattern including metal particles and an organic component on the ceramic molded body 15 are provided. A conductive pattern precursor forming step of discharging the ink for ink 200 by a droplet discharge method to form the conductive pattern precursor, a stacking step of stacking the plurality of ceramic molded bodies 15 to obtain a stacked body 17, and an acid Or it has the baking process which obtains the wiring board 32 which sinters the said laminated body 17 in the atmosphere containing a base, and has the conductor pattern 20 and the ceramic substrate 30. FIG. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10673049-B2
priorityDate 2011-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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