http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012168797-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B42D15-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K19-077
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filingDate 2011-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06e50de5995460bc4a881fb882bdd4a0
publicationDate 2012-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012168797-A
titleOfInvention IC card manufacturing system and IC card manufacturing method
abstract An IC card manufacturing system in which bubbles in an adhesive are not exposed from the side surface of the IC card. An IC card manufacturing system (20) is for manufacturing individual IC cards by cutting an IC card forming sheet (10A) including multi-sided IC cards. In the printing unit 35, it prints using infrared rays transmissive ink, and the printed sheet 11 which has a printing part is obtained. An inlet is mounted on the printed sheet 11, and a back sheet is supplied onto the inlet to obtain an IC card forming sheet 10A including an IC card. The IC card forming sheet 10 </ b> A is irradiated with infrared rays from the infrared irradiation unit 27, received with infrared rays by the CCD camera 28, and air bubbles in the adhesive are detected in the image processing unit 30 based on the image from the CCD camera 28. [Selection] Figure 1
priorityDate 2011-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 21.