abstract |
A substrate processing apparatus and a method for manufacturing a semiconductor manufacturing apparatus capable of forming a high-quality film with high productivity and few defects in a semiconductor device and preventing a decrease in yield. A plurality of processing chambers for processing a substrate, a raw material supply system for supplying a raw material into each of the processing chambers, a reactive agent supply system for supplying a reactive agent into each of the processing chambers, and the raw material supply system are provided. A raw material supply unit shared by the plurality of processing chambers; a reactant supply unit provided in the reactant supply system and shared by the plurality of processing chambers; The raw material supply system, the raw material supply system and the reactive agent are alternately supplied to process the substrate, and the raw material supply unit and the reactive agent supply unit are used in a time-sharing manner in the processing chambers. And a control unit that controls the reactant supply system, the raw material supply unit, and the reactant supply unit. [Selection] Figure 6 |