http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012163603-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2011-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f98f95c481c61f2ee76a4d959889b0bd |
| publicationDate | 2012-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012163603-A |
| titleOfInvention | Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for producing printed wiring board |
| abstract | A photosensitive resin composition, a photosensitive element, a method for producing a resist pattern, and a print capable of forming fine wiring, reducing developer contamination, good resistance to plating solution, and facilitating resist peeling after plating. A method for manufacturing a wiring board is provided. A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, wherein (B) component comprises: A photosensitive resin composition comprising two types of bisphenol A (meth) acrylate compounds having different oxyalkylene chain repeating units. [Selection figure] None |
| priorityDate | 2011-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 116.