| abstract |
A resin composition having long-term heat resistance and high adhesion and a semiconductor sealing material using the same are provided. (A) 100 parts by weight of a cyanate ester compound having an average of two or more cyanato groups in one molecule, (B) 10-500 parts by weight of a phenol compound, (C) triallyl isocyanurate 1 500 parts by weight, (D) 1 to 1000 parts by weight of an inorganic filler, and (E) 0 to 20 parts by weight of (E) epoxy resin for 100 parts by weight of the total amount of component (A), (B) and (C) Part thermosetting resin composition. [Selection figure] None |