http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012162084-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate | 2012-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be48e24409d157e89d2391c8cba85f57 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f451511b12b30df228a7eb54ff6a95cb |
| publicationDate | 2012-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012162084-A |
| titleOfInvention | Substrate with resin and copper foil with resin |
| abstract | PROBLEM TO BE SOLVED: To form a printed wiring board or a multilayer wiring board having sufficient adhesion, thermal shock resistance and crack resistance between an insulating layer and a conductive layer, and a resin-coated base material with sufficiently low dust generation during processing And providing copper foil with resin. A substrate with resin 10 is a substrate with resin comprising a substrate 1 and a resin layer 2 provided on the substrate 1, wherein the resin layer 2 has two or more glycidyl groups. And a polyamideimide resin having a weight average molecular weight of 70000 or more and 120,000 or less, and the content of the polyamideimide resin in the resin composition is 100 parts by mass of the epoxy resin. It is 10-50 mass parts with respect to. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7123786-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103415140-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020105404-A |
| priorityDate | 2012-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.