http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012160561-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2011-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38018b1182a2f709c1db7bab08619a6e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed356cbd06c8cafe0465f9d79e5568da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e98290740827f94acacee95951765ac |
| publicationDate | 2012-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012160561-A |
| titleOfInvention | Wiring board manufacturing method and wiring board |
| abstract | To provide a manufacturing method capable of efficiently manufacturing a highly reliable wiring board provided with a highly reliable conductor pattern in which occurrence of cracks, disconnections, short circuits and the like is prevented. A ceramic molded body preparing step for preparing a sheet-shaped ceramic molded body 15 made of a material containing a ceramic material and a binder, and a conductive pattern including metal particles and an organic component in the ceramic molded body 15 are provided. A conductive pattern precursor forming step of forming the conductive pattern precursor 10 by discharging the forming ink 200 by a droplet discharge method, and a portion of the ceramic molded body 15 to which the conductive pattern forming ink 200 is applied, An acid-base application step for applying a composition 300 containing an acid or a base, a lamination step for laminating a plurality of the ceramic molded bodies 15 to obtain a laminate 17, and sintering the laminate 17 to produce a conductor pattern 20 And a firing step of obtaining a wiring substrate 32 having the ceramic substrate 30. [Selection] Figure 1 |
| priorityDate | 2011-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 83.