| abstract |
A Pb-free solder having high ductility and capable of maintaining sufficient joint strength over a long period of time, a semiconductor device using the solder, and a soldering method are provided. A solder containing Sn (tin), Bi (bismuth) and Zn (zinc) and having a Zn content of 0.01 wt% to 0.1 wt% is used. For example, the Bi content is 45 wt% to 65 wt%, the Zn content is 0.01 wt% to 0.1 wt%, the remainder is Sn, or the Bi content is 45 wt% to 65 wt%, and the Sb (antimony) content is The electronic component and the substrate are joined using solder of 0.3 wt% to 0.8 wt%, Zn content of 0.01 wt% to 0.1 wt%, and the balance of Sn. [Selection] Figure 13 |