| abstract |
The present invention provides a fine solder powder suitable for a solder paste that achieves a fine pitch, good melt diffusibility during reflow, easy composition control during solder bump formation, and excellent wettability. Provided is a powder and a solder paste using the powder. In a solder powder having an average particle size of 5 μm or less, comprising a central core and a coating layer covering the central core, the central core is composed of silver, copper, nickel, indium, cobalt or gold. And the covering layer 12 is made of tin. [Selection] Figure 1 |