http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012155950-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
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filingDate 2011-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_261cb31eab2c64ea5303853156232037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85fcc48df911e101479df06041d75af6
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publicationDate 2012-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012155950-A
titleOfInvention Conductive particles, anisotropic conductive materials, and connection structures
abstract Disclosed are conductive particles that can be easily connected to each other and can further improve conduction reliability, and anisotropic conductive materials using the conductive particles. The conductive particles according to the present invention are used by being dispersed in a binder resin. The conductive particles 1 according to the present invention are disposed on a base particle 2, a first conductive layer 3 disposed on the surface 2 a of the base particle 2, and a surface 3 a outside the first conductive layer 3. The solder layer 4 is provided. The solder layer 4 has irregularities on the outer surface 4a. The anisotropic conductive material according to the present invention includes a binder resin and conductive particles 1 dispersed in the binder resin. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7000685-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015056306-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022059726-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018129369-A
priorityDate 2011-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4352097-B2
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Total number of triples: 39.