| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fa57e1a6fb0d708ac2c90d39b325fe8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
2012-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fbfb12ae83980a537ba1cb686f14722
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8dc5506c38c2b1ab8da7e44975372ea |
| publicationDate |
2012-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012149347-A |
| titleOfInvention |
Selective metal plating method for substrate and molded circuit component manufactured by the method |
| abstract |
In light of the shortcomings of laser-based methods for structuring and selective metal plating of plastic surfaces, a radically improved method is provided. The present invention relates to a method for selective metal plating of the surface of a plastic substrate and a molded circuit component produced by the method, wherein the plastic substrate is a natural or synthetically produced tecton as an additive. It contains aluminosilicate, the ablation treatment on the surface of the plastic substrate makes it possible to reach this tectoaluminosilicate, seeding, and finally metal plating without applying an electric current from the outside. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015033955-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020054581-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10304762-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018053334-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016121391-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015033955-A1 |
| priorityDate |
2011-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |