| abstract |
Provided are a photosensitive polyimide precursor and a photosensitive resin composition that have a low coefficient of thermal expansion and residual stress, excellent adhesion to a copper substrate, etc., and a high breaking strength of a produced resin. A photosensitive polyimide precursor having a repeating unit (1) obtained by polycondensation of a tetracarboxylic acid and an aromatic diamine and having an actinic functional group introduced at both ends, and having a rigid structure The aromatic tetracarboxylic acid is 70 to 100 mol% with respect to the total number of moles of tetracarboxylic acid, and the aromatic diamine contains a thiophene-containing aromatic diamine and a rigid structure aromatic diamine in a molar ratio. 3: 97-30: 70, and the actinic functional group is a phenylamino group having a carbon-carbon double bond or a dicarboxyphenylcarbonyl group having a carbon-carbon double bond as an ester. A photosensitive polyimide precursor and a photosensitive resin composition containing the precursor. [Selection figure] None |