| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2010-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72513d0a8c0085f2a687eaabf05bae80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afee2551a3c7150556fd318894579d56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c13f0b6a158b8df7e1bd5127539830a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8748fa17d04dc5529a6468fa510e59f9 |
| publicationDate |
2012-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012131902-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same |
| abstract |
To provide an epoxy resin composition for semiconductor encapsulation excellent in high temperature and high humidity reliability and moldability. An epoxy resin composition for semiconductor encapsulation containing the following components (A) to (E). And content of the following (C) component shall be 0.8-30.0 weight% with respect to the organic component of an epoxy resin composition. (A) Epoxy resin. (B) Phenolic resin [However, the following component (C) is excluded. ]. (C) A specific silane-modified phenol resin. (D) Curing accelerator. (E) Inorganic filler. [Selection figure] None |
| priorityDate |
2010-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |