http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012130905-A

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filingDate 2011-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82d97fbe482f707919097ea254e95a73
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publicationDate 2012-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012130905-A
titleOfInvention Method for forming a thin film pattern
abstract It has been newly found out that the above-mentioned proposal concerning a method for forming a thin film pattern by an ink jet method also has a problem regarding surface smoothness such as the rising edge of the thin film pattern. An object of the present invention is to provide a method for forming a thin film pattern, which can accurately produce a fine thin film pattern excellent in surface smoothness required for an electronic device as described in the background art. A method of forming a thin film pattern on a surface of a substrate by supplying ink containing a film forming material and an ink solvent from a nozzle onto the surface of the heated substrate, the ink solvent having a boiling point of 100 ° C. or less. A low boiling point solvent and a high boiling point solvent having a boiling point higher than 100 ° C., and the temperature difference between the boiling point of the low boiling point solvent having the highest boiling point and the boiling point of the high boiling point solvent having the lowest boiling point is 90 ° C. or more A method for forming a thin film pattern using an ink using a solvent. [Selection figure] None
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priorityDate 2010-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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