| abstract |
A semiconductor device encapsulating body capable of simultaneously manufacturing a plurality of packages each having a semiconductor element and capable of ensuring electrical connection vertically, and capable of manufacturing the package with high reliability. A manufacturing method and a manufacturing method of a semiconductor package are provided. A method for manufacturing a sealed semiconductor element according to the present invention includes a sealed semiconductor element having a semiconductor element, a conductive pillar, and a sealing portion that seals the semiconductor element and the conductive pillar. The semiconductor element 26 is disposed on the dummy substrate 101 and the sacrificial layer 38 is formed, and the dummy substrate 101, the semiconductor element 26, and the sacrificial layer 38 are covered. Forming the sealing portion, forming the sealing substrate, removing the dummy substrate 101, and removing the sacrificial layer 38 by heating to form the through hole 271 and then forming the conductor column 28 in the through hole 271. And a conductor pillar forming step for obtaining the semiconductor element sealing body 270. [Selection] Figure 3 |