http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012129260-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate | 2010-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab44d7cdaf588bd1f40228515bc4b250 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b7b0b86be63f35f6579c32970db7f12 |
publicationDate | 2012-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2012129260-A |
titleOfInvention | Manufacturing method of semiconductor element sealing body and manufacturing method of semiconductor package |
abstract | A semiconductor device encapsulating body capable of simultaneously manufacturing a plurality of packages each having a semiconductor element and capable of ensuring electrical connection vertically, and capable of manufacturing the package with high reliability. A manufacturing method and a manufacturing method of a semiconductor package are provided. A method of manufacturing a sealed semiconductor element according to the present invention includes a plurality of semiconductor elements having at least one electrode pad, a plurality of conductive pillars having conductivity, a semiconductor element and the conductive pillars. This is a method for manufacturing a semiconductor element sealing body 270 having a sealing portion 27 to be sealed, an arrangement step of arranging a semiconductor element 26 and a conductor column 28 on a dummy substrate 101, a dummy substrate 101, and a semiconductor element A sealing part forming step of obtaining a semiconductor element sealing body 270 on the dummy substrate 101 by sealing so as to cover the conductor 26 and the conductor pillar 28, and the semiconductor element sealing body 270. And a peeling step for peeling the dummy substrate 101. [Selection] Figure 3 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014110337-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I760225-B |
priorityDate | 2010-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 445.