Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J165-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12 |
filingDate |
2010-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf3bbfae1495c9c84d4baa197b6480f1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a68ad1febe433414617b40eed91df92 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_127d124c8faccecaa34116c1c98390f7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75b960309455861d73313480b56e91d6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_169f846dcc416df874274647f08ba7b0 |
publicationDate |
2012-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2012126781-A |
titleOfInvention |
Thermally decomposable resin composition |
abstract |
Provided is a thermally decomposable resin composition capable of firmly fixing a semiconductor wafer and a base material and capable of easily separating the semiconductor wafer and the base material. The shear strength A of the thermally decomposable resin composition 1 measured at a temperature of 25 ° C. is 100 kPa or more and 10 MPa or less, and is measured at a temperature of the softening point of the thermally decomposable resin composition 1 + 50 ° C. A thermally decomposable resin composition in which a shear strength B of the thermally decomposable resin composition is 1 kPa or more and less than 100 kPa. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020235530-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10450485-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6147458-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017065188-A1 |
priorityDate |
2010-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |