| abstract |
Disclosed is a thermal conductive adhesive that has excellent thermal conductivity, can relieve stress generated under a thermal cycle, and can increase the reliability of a semiconductor device. An epoxy compound having a structure represented by the following general formula (1), an epoxy group-containing acrylic polymer, an episulfide compound, a curing agent, and a thermally conductive filler are contained, and the general formula (1) The content of the episulfide compound with respect to 100 parts by weight of the epoxy compound represented by) is 1 part by weight or more and less than 30 parts by weight. In 100 parts by weight of the heat conductive adhesive, the content of the heat conductive filler is 40 parts. Thermally conductive adhesive that is -85 parts by weight. [Chemical 1] In general formula (1), m represents an integer of 2 to 4, and n represents an integer of 9 to 11. [Selection figure] None |