| abstract |
An insulating substrate or a metal-clad laminate that can sufficiently reduce or prevent negative warpage of a semiconductor device, and a printed wiring board and a semiconductor device using the insulating substrate or the metal-clad laminate are provided. At least one fiber base layer comprising a cured product of a laminate including one or more fiber base layers C1 and two or more resin layers r1 and r2, the outermost layers on both sides being resin layers. However, the reference position, that is, the thickness of each region obtained by equally dividing the total thickness of the insulating substrate by the number of fiber base layers is further divided into two more evenly, more unevenly distributed on one side or the other side, and in different directions A printed wiring board is manufactured using an insulating substrate having no uneven distribution or a metal-clad laminate including the insulating substrate as a core substrate. In addition, a semiconductor device is manufactured by mounting a semiconductor element on the printed wiring board. [Selection] Figure 1 |