| abstract |
A resin optical component such as a resin lens having heat resistance capable of mounting a camera module in which a semiconductor and a lens are integrated in a reflow process, a high Abbe number comparable to glass, and excellent bending strength. And an optical resin composition excellent in mold releasability suitable for molding the part. A trialkoxysilane (ii) containing an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms and a trialkoxysilane (b) containing an epoxy group is in a molar ratio of 1:99 to Silsesquioxane derivative containing 70% by weight or more of a random structure and / or a ladder structure having a weight average molecular weight of 1000 to 30000 obtained by hydrolysis and condensation at 90:10, an alicyclic skeleton-containing epoxy resin, and optics Abbe number v D obtained by curing the optical resin composition is 55 or more containing the curing agent. [Selection figure] None |