| abstract |
An object of the present invention is to provide a photosensitive material having good adhesion to a substrate, a substrate, etc., high film hardness, heat resistance and acid resistance, high transmittance, and particularly high transmittance around a wavelength of 400 nm. An object of the present invention is to provide a conductive resin composition and an insulating film for a touch panel using the same. A resin (A1) comprising a resin (A1) obtained by copolymerizing a compound (a1) represented by the general formula (1) and another compound (a2) copolymerizable with the compound (a1). ), Photoradical polymerization initiator (B), photocationic polymerization initiator (C), ethylenically unsaturated monomer (D), epoxy compound (E), and oxetane compound (F). When the weight of the monomer (D) is Met, the weight of the epoxy compound (E) is Mce, and the weight of the oxetane compound (F) is Mco, (Mce + Mco) / (Met + Mce + Mco) is 0.4 or more and 0.9 It is solved by the photosensitive resin composition characterized by the following. [Selection figure] None |