| abstract |
In a manufacturing process of a rearrangement type electronic device, the electronic component is not displaced, and the sealing material and the electronic component are not easily damaged, and even when a residue is attached, it can be easily removed. An electronic device manufacturing method, an electronic device, an electronic device package manufacturing method, and an electronic device package are provided. A step of forming a fixing resin layer 60 on a support substrate 50, a step of fixing an electronic component 11, a step of forming a sealing material layer 70, and a step of obtaining a cured electronic component placement sealing material 80 And a step of peeling the electronic component placement sealing material cured product 80 from the support substrate 50. In the peeling step, the fixed resin layer 60 is heated after being irradiated with active energy rays. Then, the electronic component arrangement sealing material cured product 80 is peeled off from the support substrate 50. [Selection] Figure 2 |