| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate |
2010-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c840e1a6343c43a3b489ecbfa72f95ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c13f0b6a158b8df7e1bd5127539830a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afee2551a3c7150556fd318894579d56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7df932d6e639aeda44b7731e1b60454d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8748fa17d04dc5529a6468fa510e59f9 |
| publicationDate |
2012-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012104674-A |
| titleOfInvention |
Manufacturing method of semiconductor devices |
| abstract |
The present invention provides a method for manufacturing a semiconductor device that is excellent in high-temperature and high-humidity reliability without reducing moldability and curability. A heat treatment step is performed after resin sealing using an epoxy resin composition for semiconductor sealing containing an epoxy resin represented by the following general formula (1). [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014015490-A |
| priorityDate |
2010-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |