| abstract |
A polishing pad is provided which improves planarization, removal rate and scratches and has less pad-to-pad variation. A gas-filled polymer microelement has a shell and a density of 5 g / liter to 200 g / liter, the shell has a silicate particle embedded in the polymer, an outer surface and a diameter of 5 μm to 200 μm, the silicate particle Has an average particle size of 0.01-3 μm, the silicate-containing region is kept at a distance so as to cover less than 50% of the outer surface of the polymer microelement, and 0.1% by weight of the total of the polymer microelement Less than i) silicate particles having a particle size greater than 5 μm, ii) a silicate-containing region that covers more than 50% of the outer surface of the polymer microelement, and iii) a cluster size that aggregates with the silicate particles and exceeds an average of 120 μm A plurality of polymer particles associated with the polymer microelements. [Selection figure] None |