| abstract |
Disclosed is a die attachment adhesive containing a metal salt of a quinolinol derivative as an adhesion promoter and a conductivity promoter. The die attach composition of the present invention exhibits improved adhesion and conductivity by adding a metal salt of an 8-quinolinol derivative as an adhesion and / or conductivity promoter. Metal salts of 8-quinolinol derivatives are Cu, Be, Mg, Ca, Sr, Ba, Zn, Cd, Al, Ga, In, Tl, Yt, La, Pb, Sb, Bi, Cr, Mo, Mn, Fe , Co, Ni, Pd, Ce, and Pr are formed by coordination. [Selection figure] None |