http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012094754-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2010-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5a54a96d925d55d9e3cc04346364d4e |
| publicationDate | 2012-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012094754-A |
| titleOfInvention | Circuit board and electronic device |
| abstract | An object of the present invention is to provide a circuit board and an electronic device that are excellent in long-term reliability, in which cracks and cracks are prevented from occurring in an insulating substrate and heat generated from electronic components is dissipated well. A circuit board includes an insulating substrate having a through hole, a metal plate that is attached so as to close the through hole on both surfaces of the insulating substrate, and on which an electronic component is mounted, and a through hole. A metal body 5 having both ends bonded to metal plates 3 disposed inside and attached to both surfaces of the insulating substrate 1, and an outer surface bonded to the inner wall surface of the through hole via the brazing filler metal layer 2, the inner surface being a metal body. 5 and a frame 6 having a thermal expansion coefficient smaller than that of the metal body 5. The heat generated from the electronic component 20 is efficiently dissipated to the outside to prevent the insulating substrate 1 from being cracked or broken. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016176098-A |
| priorityDate | 2010-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.