http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012084923-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B18-00 |
| filingDate | 2012-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_858ad7783dccf58b38b70c1d0e52c6b4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20f09179a6e6d2197e58d9e89ddf92fd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c29d576fc40b303f0007b38d9b1edd43 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19218a83f95ab9b1567f1ed1090142fa |
| publicationDate | 2012-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012084923-A |
| titleOfInvention | Composite material for wiring board and manufacturing method thereof |
| abstract | An object of the present invention is to provide a composite material having an insulating material that has the advantages of both inorganic and organic materials, and realizes excellent heat resistance, moisture resistance, and electric corrosion resistance, and excellent low stress properties. And a new composite material for a wiring board that has a low coefficient of thermal expansion. A composite material for a wiring board comprising a layer made of an inorganic material and a resin layer, wherein the difference in thermal expansion coefficient between the inorganic material and the resin is 10 × 10 −6 / ° C. or less. material. [Selection figure] None |
| priorityDate | 2012-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 106.