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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
filingDate 2010-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e62fb542b0edd62acfb1bfcc5d123143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d0bebd633f9180934cf3dfda4c03f7c
publicationDate 2012-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012084440-A
titleOfInvention Thermosetting conductive paste
abstract The present invention provides a thermosetting conductive paste that is excellent in thixotropic property, has good coating suitability, and can suppress bleed-out while maintaining a low specific resistance value. A thermosetting conductive paste comprising (A) a conductive filler, (B) a thermosetting binder, (C) a cellulose resin, and (D) an acrylonitrile-butadiene copolymer in some cases. (B) a thermosetting resin and a curing agent in a thermosetting binder, (C) a cellulose resin, and (D) an acrylonitrile-butadiene copolymer optionally contained in the thermosetting conductive paste 1 to 10% by mass of (B) thermosetting resin and curing agent in thermosetting binder, (C) cellulose resin, and (D) acrylonitrile-butadiene copolymer optionally contained The content of the (C) cellulose resin in the total amount of 2 to 60% by mass is a thermosetting conductive paste. [Selection figure] None
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