http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012083262-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d527f9a5c3e991a1797de3518a88d14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2010-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_604094c168cc91a67631ea485bb25b34 |
| publicationDate | 2012-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012083262-A |
| titleOfInvention | Test apparatus and test method |
| abstract | A test apparatus and a test method capable of testing a semiconductor device including a TSV are provided. A DUT has a three-dimensional mounting package structure having a first semiconductor chip and a second semiconductor chip. The controller 34 outputs the first level voltage to the first output buffer BUF1 connected to the TSV 14 to be inspected while switching the TSV 14 to be inspected in order, and also causes the second output buffer BUF2 connected to the TSV 14 to A voltage at a second level different from the first level is output. The power supply device 30 supplies the power supply voltage V DD to the power supply terminal P1. Current measuring unit 32 measures the current I DD flowing to the power supply terminal P1. Determining unit 36, based on the current I DD measured by the current measuring unit 32 for each TSV14, it determines failure of each TSV14. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170025988-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105093086-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102373541-B1 |
| priorityDate | 2010-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.