http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012079927-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d44f64041ec670253ae3547921f640fb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 |
| filingDate | 2010-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b82f779a0ce899fd8dd2054d76cdba68 |
| publicationDate | 2012-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012079927-A |
| titleOfInvention | Solderable conductive structure |
| abstract | An object of the present invention is to provide an EMC gasket which can be mounted on a conductive structure, particularly a printed circuit board (PCB), which can be soldered with reliability. A pressure-sensitive adhesive resin (R) in which conductive powder (M) is highly blended on at least the bottom surface of the outer peripheral surface of an electrically conductive and elastic main body (1). Solderable layer (2) The main body (1) is a conductive part that is electrically connected between a lower surface on the bottom side and an upper surface on the top side (1). 1A), and the solderable layer (2) is made of a pressure-sensitive adhesive resin (R) layer in which a conductive powder (M) is highly blended. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014005368-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021200298-A1 |
| priorityDate | 2010-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.