http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012074736-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2011-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8534776dcd693ec521554d5e9c14e31b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe27506479ee451358c4b587d00a89e5
publicationDate 2012-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012074736-A
titleOfInvention CMP composition for improved oxide removal rate
abstract The present invention provides a chemical-mechanical polishing composition comprising an abrasive, a halide salt, and water. The present invention further provides a method of chemically-mechanically polishing a substrate with a chemical-mechanical polishing composition and a polishing pad. A chemical-mechanical polishing composition comprising: (A) 0.01% to 1% by weight of an abrasive selected from the group consisting of alumina, ceria, zirconia, and combinations thereof (b) an anion selected from the group consisting of Cl − , Br − , and I − Comprising 0.05 mM to 30 mM halide salt, and (c) water, Here, a polishing composition having a pH of less than 9. [Selection figure] None
priorityDate 2004-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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