| abstract |
A photosensitive resin composition capable of forming a pattern having excellent heat resistance is provided. A photosensitive resin composition comprising (A), (B), (C), (D) and (E). (A) a structural unit derived from at least one selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a structural unit derived from an unsaturated compound having a C2-C4 cyclic ether structure; (However, there is no structural unit derived from an unsaturated compound having a C 4-6 perfluoroalkyl group.) (B) An unsaturated compound having a C 4-6 perfluoroalkyl group (C) Polymerizable compound (D) Polymerization initiator (E) Solvent [Selection] None |