http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012072367-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
filingDate | 2011-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a68ad1febe433414617b40eed91df92 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75b960309455861d73313480b56e91d6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_169f846dcc416df874274647f08ba7b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_127d124c8faccecaa34116c1c98390f7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf3bbfae1495c9c84d4baa197b6480f1 |
publicationDate | 2012-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2012072367-A |
titleOfInvention | Thermally decomposable resin composition and substrate |
abstract | A thermally decomposable resin composition capable of improving the productivity of a semiconductor device is provided. A thermally decomposable resin composition is formed by applying a thermally decomposable resin composition to a semiconductor wafer or a substrate to form a thermally decomposable resin layer. The step of fixing the semiconductor wafer 2 and the base material 3 via the resin layer 1 to form the laminate 4, the step of processing the semiconductor wafer 2 of the laminate 4, heating the laminate 4, and Used in a method of manufacturing a semiconductor device including a step of thermally decomposing the decomposable resin layer 1, a step of separating the semiconductor wafer 2 and the base material 3, and the heat decomposable resin composition at 200 ° C. The melt viscosity is 0.1 Pa · s or more and 1000 Pa · s or less. [Selection] Figure 2 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111599742-A |
priorityDate | 2010-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 131.