abstract |
The present invention provides a thermosetting resin composition capable of enhancing the thermal conductivity of a cured resin portion covering the periphery of a solder portion and improving heat dissipation. A thermosetting resin composition includes a solder particle having a melting point of 240 ° C. or less, a thermosetting resin binder, an inorganic filler, and an aliphatic carboxylic acid having a specific structure having a carboxyl group at a terminal as a flux component. Contains compounds. [Selection figure] None |