| abstract |
[PROBLEMS] To suppress curing shrinkage when filling and curing a hole in a package substrate for semiconductor mounting with resin, to reduce internal stress, and to be used in a semiconductor chip mounting temperature range, a thermal cycle temperature range, or under high temperature and high humidity. A thermosetting resin filler capable of improving the reliability of the substrate is provided. A thermosetting resin filler includes a first epoxy resin that is liquid at 25 ° C. and a second epoxy resin having an epoxy equivalent of 200 or more, and is measured at 25 ° C. and 5 rpm by a cone plate viscometer. The mixed epoxy resin whose viscosity is 2-100Ps, an epoxy resin curing agent, and an inorganic filler are included. [Selection figure] None |