http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012067290-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K11-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2011-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4be18fdad7e347e08411a7a237d914f6 |
| publicationDate | 2012-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012067290-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract | An epoxy resin composition for encapsulating a semiconductor for use in marking that has a good laser marking property and enables easy and clear identification of the type and manufacturer of a semiconductor device, and encapsulation using the same A semiconductor device is provided. A resin composition for encapsulating a semiconductor, which is a molded body that absorbs light to emit light, and contains at least an epoxy resin, a curing agent, an inorganic filler, a curing catalyst, and a phosphorescent phosphor. Features. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113845744-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230044982-A |
| priorityDate | 2010-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.