http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012064981-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2011-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a6c5e8a239e20ef34264cd33ab1af6e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efb877b035151a0705ad5931f46184de |
| publicationDate | 2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012064981-A |
| titleOfInvention | Device mounting substrate, device mounting substrate manufacturing method, semiconductor module, and semiconductor module manufacturing method |
| abstract | In a structure for connecting a protruding structure and an electrode of a semiconductor element, connection reliability between the protruding structure and the electrode of the semiconductor element is improved. An element mounting substrate is electrically connected to and insulated from an insulating resin layer, a wiring layer provided on one main surface of the insulating resin layer, and the wiring layer. And a protruding electrode 16 protruding to the resin layer 12 side. Concavities and convexities are formed on the side surface of the protruding electrode 16, and the surface roughness of the side surface is larger than the top surface of the protruding electrode 16. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018152538-A |
| priorityDate | 2011-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.