Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_217f357cdf25f5b68f965728040b8ef0 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-26 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate |
2011-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1118083195d8382fef5e2d8f79c84425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9868a4de4a7258d8c18056ea0a236bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c1fabaaa69e7edd372b4332b577ca69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40d1047a2611cceae9c94c28056dd480 |
publicationDate |
2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2012064955-A |
titleOfInvention |
Laminate, metal foil-clad laminate, printed wiring board, circuit board, LED backlight unit, LED lighting device, and method for producing laminate |
abstract |
A laminated board with high heat dissipation is provided. A nonwoven fabric layer containing a thermosetting resin composition. In the thermosetting resin composition, the inorganic filler contains more than 150 parts by volume and not more than 400 parts by volume with respect to 100 parts by volume of the thermosetting resin. The inorganic filler is (A) gibbsite-type aluminum hydroxide particles having an average particle diameter (D 50 ) of 2 to 15 μm. (B) Boehmite particles having an average particle size (D 50 ) of 1.5 to 15 μm and crystal water having an average particle size (D 50 ) of 1.5 to 15 μm and a freezing start temperature of 400 ° C. or higher. At least one inorganic component selected from the group consisting of inorganic particles containing or not containing crystal water. (C) A fine particle component composed of aluminum oxide particles having an average particle diameter (D 50 ) of 1.5 μm or less. The mixing ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A), the inorganic component (B), and the fine particle component (C) is 1: 0.1 to 3: 0.1 to 3. Contains epoxy resin and phenolic compound. [Selection] Figure 1 |
priorityDate |
2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |